FUJIAN NANPING SANJIN ELECTRONICS

SMD Kovar Flat Lids


Product Name SMD Kovar Flat Lids Standard Normal or Customized
Min. Order 100,000Pieces Material Kovar, Covar
Trade Terms FOB, CFR, CIF, DEQ, FAS, DDP, DAP, CIP, CPT, FCA, EXW Payment Terms L/C,T/T,D/P,Western Union,Paypal,Money Gram,cash
Packing Vacuum Package Surface Finishing Nickel-plating, Gold-plating
Material Thickness 0.06mm, 0.07mm, 0.08mm, 0.10mm Plating Thickness 3um~6um
Introduction: Plating range: with options of gold plating per ASTM B-488 and Mil-G-45205C,
electrolytic nickel per QQ-N-290 and ASTM B-689,
electroless nickel per Mil-C-26074E and ASTM B-733 for sealing to the package.
Sealing: Seam sealing process with ceramic package.
Applicable Package sizes: 2016 , 2520 , 3025 , 3225 , 3030 , 3838 , 4025 , 5032 , 5050 , 6035 , 7050 .

SMD Kovar Stepped Lids



Product Name SMD Kovar Stepped Lids Standard Normal or Customized
Min. Order 1,000Pieces Material Kovar, Covar, Alloy42
Trade Terms FOB, CFR, CIF, DEQ, FAS, DDP, DAP, CIP, CPT, FCA, EXW Payment Terms L/C,T/T,D/P,Western Union,Paypal,Money Gram,cash
Packing Vacuum Package Surface Finishing Nickel-plating, Gold-plating
Material Thickness 0.10mm, 0.15mm, 0.20mm, 0.25mm, 0.35mm, 0.40mm, 0.80mm, 1.00mm Plating Thickness 3um~6um
Introduction: Sanjin also offer a wide range of electronic packaging, or step lids that are used in the microelectronic and fiber optic industry. Our lids are typically made from Kovar or Alloy 42, with options of gold plating, electrolytic nickel and electroless nickel for sealing to the package. Besides precision fabrication of the lid, Sanjin removes any tabs or burrs from the lid to ensure a smooth, flawless edge.
 
TO Metal Caps



Product Name TO Metal Caps Standard Normal or Customized
Min. Order 10,000Pieces Material Kovar, Covar, Copper, Nickel, 304SS
Trade Terms FOB, CFR, CIF, DEQ, FAS, DDP, DAP, CIP, CPT, FCA, EXW Payment Terms L/C,T/T,D/P,Western Union,Paypal,Money Gram,cash
Packing Normal Package Surface Finishing Nickel-plating, Gold-plating
Material Thickness 0.10mm, 0.15mm, 0.20mm, 0.25mm, 0.35mm, 0.40mm Plating Thickness 3um~6um
Introduction: TO Cans are available in a wide assortment of sizes designed to work with the transistor outline--TO headers and they are intended for high reliability miniature microcircuit applications. 
We manufacture a wide variety of TO-Cans (covers) for the TO Headers.TO Cans are available with weld projection as well as solder seal.

CerDIP Lead Frames


 
Product Name CerDIP Lead Frames Standard Normal or Customized
Min. Order 10,000Pieces Material Alloy 42 Al-Cladding
Trade Terms FOB, CFR, CIF, DEQ, FAS, DDP, DAP, CIP, CPT, FCA, EXW Payment Terms L/C,T/T,D/P,Western Union,Paypal,Money Gram,cash
Packing Normal Package Material Thickness 0.25mm
Introduction: Lead frames are used for IC Chip, and semiconductor product. Lead frames serves as connecting medium between chips and printed circuit boards, and plays the role of signal transmission. 
Lead frame available in pin configurations from 8 to 40. And we are typically made from Alloy 42 with Al cladding.
 
 
 
Ceramic Packages


 
Product Name Ceramic Packages Standard Normal or Customized
Min. Order 1,000Pieces Material Alumina 90~92%(Al2O3)
Trade Terms FOB, CFR, CIF, DEQ, FAS, DDP, DAP, CIP, CPT, FCA, EXW Payment Terms L/C,T/T,D/P,Western Union,Paypal,Money Gram,cash
Packing Normal Package Consists of Substrate and Lid
Introduction: The packages offer a cost effective, high performance, alternative to the standard three-layer ceramic package. It is a military approved package with excellent reliability characteristics. The package consists of an alumina (Al2O3) base and lid, hermetically sealed to the lead frame with solder glass available in pin configurations from 8 to 40.